Good PCB layout is the foundation of reliable electronics. Poor layout can cause signal integrity issues, thermal problems, and manufacturing defects. This guide covers essential best practices.
Component Placement Strategy
Group by Function
Keep related components together—power, analog, digital, and RF sections separated.
Consider Signal Flow
Arrange components to minimise trace lengths for critical signals.
Thermal Planning
Place heat-generating components where they can be cooled effectively.
Assembly Access
Ensure adequate spacing for soldering, rework, and test probe access.
Routing Guidelines
Power Distribution
- Use dedicated power and ground planes where possible
- Keep power traces short and wide to minimise impedance
- Place decoupling capacitors close to IC power pins
- Use multiple vias for plane connections
Signal Integrity
- Controlled Impedance: Match trace impedance for high-speed signals
- Length Matching: Match trace lengths for differential pairs
- Crosstalk Prevention: Maintain spacing between parallel traces
- Return Paths: Ensure clean return current paths
Thermal Management
Heat is the enemy of reliability. Every 10°C rise roughly halves component lifespan.
- Use thermal vias under hot components
- Consider copper pours for heat spreading
- Leave space for heatsinks and airflow
- Simulate thermal performance for high-power designs
Design for Manufacturing (DFM)
Minimum Spacing
Respect manufacturer minimums for trace/space, hole size, and annular rings.
Solder Mask
Ensure adequate solder mask dams between pads to prevent bridging.
Silkscreen
Keep silkscreen clear of pads. Use readable text sizes (min 0.8mm).
Test Points
Add test points for critical signals to enable debugging.
Review Checklist
- ✓ All nets connected (no unrouted connections)
- ✓ Design rules check (DRC) passes
- ✓ Correct component footprints verified
- ✓ Adequate clearances for high-voltage
- ✓ Mounting holes and board outline correct
- ✓ Fiducial marks for SMT assembly
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